ICROS™ Tape 類型
Conventional Tapes – Non-UV Type
The non-UV conventional type of the ICROS™ backgrounding wafer tape line features little to no contamination transferred to the wafer surface, outstanding topography absorption, prevents water penetration and wafer breakage, and superior TTV.
- Superior TTV
- Soft & Hard type
- Multiple thickness types
- No residue after removal
- Low ionic impurities
- Easy detaping
- Many adhesive types and strengths
Conventional Tapes -UV Type
The UV tape of the ICROS™ backgrinding wafer tape line features high adhesive strength, no contamination transferred to the wafer surface, outstanding topography absorption, prevents water penetration and wafer breakage, and superior TTV.
- Superior TTV
- Soft & Hard type
- Multiple thickness types
- No residue after removal
- Low ionic impurities
- Easy detaping
- High adhesion strength
