ICROS™ Tape has been the world’s top BG(Back grinding) tape for many decades. Now, our tape is not only used for the BG process but also for many other processes in semiconductor manufacturing flow. Please refer to each tape explanation for more details.

Main features of ICROS™ Tape

• Extremely Low contaminated Tape (both UV and Non-UV)
• Superior Total Thickness Type
• High Adhesion and Easy Peel
• High Heat Resistance & Chemical resistant Tape
• Bump Absorption of the wafer in the process
• Custom Made possible

Patents

Numerous patents held in the United States, Japan, Singapore, and Korea.

ISO

We acquire the certification of ISO9001 and ISO14001.